Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. - John U. Knickerbocker; Paul S. Andry; L. Paivikki Buchwalter; Alina Deutsch; Raymond R. Horton; Keith A. Jenkins; Young Hoon Kwark; Gerald McVicker; Chirag S. Patel; Robert J. Polastre; Christian D. Schuster; Arun Sharma; et al. (IBM J. Res. Dev., 2005)

Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems. - Muhannad S. Bakir; Bing Dang; James D. Meindl (CICC, 2007)

3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation. - Muhannad S. Bakir; Calvin King; Deepak C. Sekar; Hiren D. Thacker; Bing Dang; Gang Huang; Azad Naeemi; James D. Meindl (CICC, 2008)

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. - Paul S. Andry; Cornelia K. Tsang; Bucknell C. Webb; Edmund J. Sprogis; Steven L. Wright; Bing Dang; Dennis G. Manzer (IBM J. Res. Dev., 2008)

3D chip stacking with C4 technology. - Bing Dang; Steven L. Wright; Paul S. Andry; Edmund J. Sprogis; Cornelia K. Tsang; M. John Interrante; Bucknell C. Webb; Robert J. Polastre; Raymond R. Horton; Chirag S. Patel; Arun Sharma; J. Zheng; et al. (IBM J. Res. Dev., 2008)

Three-dimensional silicon integration. - John U. Knickerbocker; Paul S. Andry; Bing Dang; Raymond R. Horton; Mario J. Interrante; Chirag S. Patel; Robert J. Polastre; Katsuyuki Sakuma; Ranjani Sirdeshmukh; Edmund J. Sprogis; Sri M. Sri-Jayantha; Antonio M. Stephens; et al. (IBM J. Res. Dev., 2008)

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. - Katsuyuki Sakuma; Paul S. Andry; Cornelia K. Tsang; Steven L. Wright; Bing Dang; Chirag S. Patel; Bucknell C. Webb; J. Maria; Edmund J. Sprogis; S. K. Kang; Robert J. Polastre; Raymond R. Horton; et al. (IBM J. Res. Dev., 2008)

An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects. - Timothy O. Dickson; Yong Liu 023; Sergey V. Rylov; Bing Dang; Cornelia K. Tsang; Paul S. Andry; John F. Bulzacchelli; Herschel A. Ainspan; Xiaoxiong Gu; Lavanya Turlapati; Michael P. Beakes; Benjamin D. Parker; et al. (IEEE J. Solid State Circuits, 2012)

An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors. - Kevin Tien; Noah Sturcken; Naigang Wang; Jae-Woong Nah; Bing Dang; Eugene J. O'Sullivan; Paul S. Andry; Michele Petracca; Luca P. Carloni; William J. Gallagher; Kenneth L. Shepard (VLSIC, 2015)

NOx Emission Flux Measurements with Multiple Mobile-DOAS Instruments in Beijing. - Yeyuan Huang; Ang Li; Pinhua Xie; Zhaokun Hu; Jin Xu; Xiaoyi Fang; Hongmei Ren; Xiaomei Li; Bing Dang (Remote. Sens., 2020)

Development of a Smart Sleep Mask with Multiple Sensors. - Bing Dang; John Dicarlo; Stanislav Lukashov; Nigel Hinds; Jenna Reinen; Bo Wen; Tian Hao; Erhan Bilal; Jeff Rogers (EMBC, 2021)

Health Guardian Platform: A technology stack to accelerate discovery in Digital Health research. - Bo Wen; Vince S. Siu; Italo Buleje; Kuan Yu Hsieh; Takashi Itoh; Lukas Zimmerli; Nigel Hinds; Elif Eyigöz; Bing Dang; Stefan von Cavallar; Jeffrey L. Rogers (ICDH, 2022)

A Versatile Data Fabric for Advanced IoT-Based Remote Health Monitoring. - Italo Buleje; Vince S. Siu; Kuan Yu Hsieh; Nigel Hinds; Bing Dang; Erhan Bilal; Thanhnha Nguyen; Ellen E. Lee; Colin A. Depp; Jeffrey L. Rogers (ICDH, 2023)

Health Guardian: Using Multi-modal Data to Understand Individual Health. - Vince S. Siu; Kuan Yu Hsieh; Italo Buleje; Takashi Itoh; Tian Hao; Ben Civjan; Nigel Hinds; Bing Dang; Jeffrey L. Rogers; Bo Wen (ICDH, 2023)