Thermal and power-aware task scheduling for Hadoop based storage centric datacenters. - Bing Shi 001; Ankur Srivastava 001 (Green Computing Conference, 2010)

Dynamic thermal management for single and multicore processors under soft thermal constraints. - Bing Shi 001; Yufu Zhang; Ankur Srivastava 001 (ISLPED, 2010)

A statistical framework for designing on-chip thermal sensing infrastructure in nano-scale systems. - Yufu Zhang; Bing Shi 001; Ankur Srivastava 001 (ISPD, 2010)

Cooling of 3D-IC using non-uniform micro-channels and sensor based dynamic thermal management. - Bing Shi 001; Ankur Srivastava 001 (Allerton, 2011)

Non-uniform micro-channel design for stacked 3D-ICs. - Bing Shi 001; Ankur Srivastava 001; Peng Wang (DAC, 2011)

Liquid cooling for 3D-ICs. - Bing Shi 001; Ankur Srivastava 001 (IGCC, 2011)

Unified datacenter power management considering on-chip and air temperature constraints. - Bing Shi 001; Ankur Srivastava 001 (Sustain. Comput. Informatics Syst., 2011)

TSV-constrained micro-channel infrastructure design for cooling stacked 3D-ICs. - Bing Shi 001; Ankur Srivastava 001 (ISPD, 2012)

Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs. - Bing Shi 001; Ankur Srivastava 001; Avram Bar-Cohen (ISVLSI, 2012)

Accelerating Gate Sizing Using Graphics Processing Units. - Bing Shi 001; Yufu Zhang; Ankur Srivastava 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012)

Thermal and Power-Aware Task Scheduling and Data Placement for Storage Centric Datacenters. - Bing Shi 001; Ankur Srivastava 001 (Handbook of Energy-Aware and Green Computing, 2012)

High performance 3D stacked DRAM processor architectures with micro-fluidic cooling. - Caleb Serafy; Bing Shi 001; Ankur Srivastava 001; Donald Yeung (3DIC, 2013)

Thermal stress aware 3D-IC statistical static timing analysis. - Bing Shi 001; Ankur Srivastava 001 (ACM Great Lakes Symposium on VLSI, 2013)

Co-optimization of TSV assignment and micro-channel placement for 3D-ICs. - Bing Shi 001; Caleb Serafy; Ankur Srivastava 001 (ACM Great Lakes Symposium on VLSI, 2013)

Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and Design. - Bing Shi 001; Ankur Srivastava 001 (Adv. Comput., 2013)

Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit. - Bing Shi 001; Ankur Srivastava 001; Avram Bar-Cohen (IET Circuits Devices Syst., 2013)

Dynamic Thermal Management Under Soft Thermal Constraints. - Bing Shi 001; Yufu Zhang; Ankur Srivastava 001 (IEEE Trans. Very Large Scale Integr. Syst., 2013)

A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs. - Caleb Serafy; Bing Shi 001; Ankur Srivastava 001 (Integr., 2014)

Optimized Micro-Channel Design for Stacked 3-D-ICs. - Bing Shi 001; Ankur Srivastava 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014)

Statistical Framework for Designing On-Chip Thermal Sensing Infrastructure in Nanoscale Systems. - Yufu Zhang; Bing Shi 001; Ankur Srivastava 001 (IEEE Trans. Very Large Scale Integr. Syst., 2014)