Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique. - Huei Hao Yap; Pik Kee Tan; G. R. Low; M. K. Dawood; Hua Feng; Yuzhe Zhao; Ran He; Hao Tan; J. Zhu; Binghai Liu; Y. M. Huang; D. D. Wang; et al. (Microelectron. Reliab., 2015)

Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system. - Yuzhe Zhao; Q. J. Wang; Pik Kee Tan; Huei Hao Yap; Binghai Liu; H. Feng; Hao Tan; Ran He; Y. M. Huang; D. D. Wang; Lei Zhu; C. Q. Chen; et al. (Microelectron. Reliab., 2016)

Failure analysis on 14 nm FinFET devices with ESD CDM failure. - Shaalini Chithambaram; Pik Kee Tan; Yuzhe Zhao; Binghai Liu; Yinzhe Ma; Alfred Quah; Dayanand Nagalingam; Yanlin Pan; Zhihong Mai (Microelectron. Reliab., 2018)

Cross-sectional nanoprobing sample preparation on sub-micron device with fast laser grooving technique. - Pik Kee Tan; Yuzhe Zhao; Francis Rivai; Binghai Liu; Yanlin Pan; Ran He; Hao Tan; Zhihong Mai (Microelectron. Reliab., 2018)