Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. - Mike Roellig; Rainer Dudek; Steffen Wiese; Bjoern Boehme; Bernhard Wunderle; Klaus-Jürgen Wolter; Bernd Michel (Microelectron. Reliab., 2007)

Study of temperature dependent properties of organic substrate materials. - Bjoern Boehme; Klaus-Jürgen Wolter (Microelectron. Reliab., 2008)

Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling. - Viktor Dudash; Kashi Vishwanath Machani; Bjoern Boehme; Simone Capecchi; Jungtae Ok; Karsten Meier; Frank Kuechenmeister; Marcel Wieland; Karlheinz Bock (IRPS, 2023)