Thermal impedance plots of micro-scaled devices. - Bjorn Vermeersch; Gilbert De Mey (Microelectron. Reliab., 2006)

Influence of substrate thickness on thermal impedance of microelectronic structures. - Bjorn Vermeersch; Gilbert De Mey (Microelectron. Reliab., 2007)

Influence of thermal contact resistance on thermal impedance of microelectronic structures. - Bjorn Vermeersch; Gilbert De Mey (Microelectron. Reliab., 2007)

Dependency of thermal spreading resistance on convective heat transfer coefficient. - Bjorn Vermeersch; Gilbert De Mey (Microelectron. Reliab., 2008)

Dynamic thermal modelling of a power integrated circuit with the application of structure functions. - Marcin Janicki; Jedrzej Banaszczyk; Gilbert De Mey; Marek Kaminski; Bjorn Vermeersch; Andrzej Napieralski (Microelectron. J., 2009)

Dynamic electrothermal simulation of integrated resistors at device level. - Bjorn Vermeersch; Gilbert De Mey (Microelectron. J., 2009)

Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses. - Marcin Janicki; Jedrzej Banaszczyk; Bjorn Vermeersch; Gilbert De Mey; Andrzej Napieralski (Microelectron. Reliab., 2011)

almaBTE : A solver of the space-time dependent Boltzmann transport equation for phonons in structured materials. - Jesús Carrete; Bjorn Vermeersch; Ankita Katre; Ambroise van Roekeghem; Tao Wang; Georg K. H. Madsen; Natalio Mingo (Comput. Phys. Commun., 2017)

Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks. - Amita Rawat; Krishna K. Bhuwalka; Philippe Matagne; Bjorn Vermeersch; Hao Wu; Geert Hellings; Julien Ryckaert; Changze Liu (ESSDERC, 2021)

Impact of channel thickness scaling on the performance of GaN-on-Si RF HEMTs on highly C-doped GaN buffer. - AliReza Alian; Raúl Rodríguez; Sachin Yadav 001; Uthayasankaran Peralagu; Arturo Sibaja Hernandez; Vamsi Putcha; Ming Zhao; Rana Y. El Kashlan; Bjorn Vermeersch; Hao Yu; Erik Bury; Ahmad Khaled; et al. (ESSDERC, 2022)

III-V HBTs on 300 mm Si substrates using merged nano-ridges and its application in the study of impact of defects on DC and RF performance. - Abhitosh Vais; Sachin Yadav 001; Yves Mols; Bjorn Vermeersch; Komal Vondkar Kodandarama; Marina Baryshnikova; G. Mannaert; R. Alcotte; Geert Boccardi; Piet Wambacq; Bertrand Parvais; R. Langer; et al. (ESSDERC, 2022)

Self-Heating in iN8-iN2 CMOS Logic Cells: Thermal Impact of Architecture (FinFET, Nanosheet, Forksheet and CFET) and Scaling Boosters. - Bjorn Vermeersch; Erik Bury; Yang Xiang; Pieter Schuddinck; Krishna K. Bhuwalka; Geert Hellings; Julien Ryckaert (VLSI Technology and Circuits, 2022)

Thermal Performance Analysis of Mempool RISC-V Multicore SoC. - Sankatali Venkateswarlu; Subrat Mishra; Herman Oprins; Bjorn Vermeersch; Moritz Brunion; Jun-Han Han; Mircea R. Stan; Pieter Weckx; Francky Catthoor (IEEE Trans. Very Large Scale Integr. Syst., 2022)

Towards accurate temperature prediction in BEOL for reliability assessment (Invited). - Melina Lofrano; Herman Oprins; Xinyue Chang; Bjorn Vermeersch; Olalla Varela Pedreira; Alicja Lesniewska; Vladimir Cherman; Ivan Ciofi; Kristof Croes; Seongho Park; Zsolt Tokei (IRPS, 2023)

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). - Subrat Mishra; Sankatali Venkateswarlu; Bjorn Vermeersch; Moritz Brunion; Melina Lofrano; Dawit Burusie Abdi; Herman Oprins; Dwaipayan Biswas; Odysseas Zografos; Gaspard Hiblot; Geert Van der Plas; Pieter Weckx; et al. (IRPS, 2023)

Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC. - Sankatali Venkateswarlu; Subrat Mishra; Herman Oprins; Bjorn Vermeersch; Moritz Brunion; Jun-Han Han; Mircea R. Stan; Dwaipayan Biswas; Pieter Weckx; Francky Catthoor (IEEE Trans. Very Large Scale Integr. Syst., 2023)

Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation. - Subrat Mishra; Bjorn Vermeersch; Sankatali Venkateswarlu; Halil Kukner; A. Sharma; G. Mirabeli; Fabian M. Bufler; Moritz Brunion; Dawit Burusie Abdi; Herman Oprins; Dwaipayan Biswas; Odysseas Zografos; et al. (IRPS, 2024)

Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5). - S. Mishra; Bjorn Vermeersch; Sankatali Venkateswarlu; Halil Kukner; Gioele Mirabelli; Fabian M. Bufler; Moritz Brunion; Dawit Burusie Abdi; Herman Oprins; Dwaipayan Biswas; Odysseas Zografos; Francky Catthoor; et al. (VLSI Technology and Circuits, 2024)

Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology. - Yukai Chen; Massimiliano Di Todaro; Bjorn Vermeersch; Herman Oprins; Daniele Jahier Pagliari; Julien Ryckaert; Dwaipayan Biswas; James Myers (CoRR, 2025)