Effect of surface finish material on printed circuit board for electrochemical migration. - Bo-In Noh; Jong-Bum Lee; Seung-Boo Jung (Microelectron. Reliab., 2008)

Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. - Jeong-Won Yoon; Hyun-Suk Chun; Bo-In Noh; Ja-Myeong Koo; Jong-Woong Kim; Hoo-Jeong Lee; Seung-Boo Jung (Microelectron. Reliab., 2008)

Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint. - Jeong-Won Yoon; Bo-In Noh; Young-Ho Lee; Hyo-Soo Lee; Seung-Boo Jung (Microelectron. Reliab., 2008)

Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test. - Jeong-Won Yoon; Min-Kwan Ko; Bo-In Noh; Seung-Boo Jung (Microelectron. Reliab., 2013)

Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions. - Jeong-Won Yoon; Bo-In Noh; Seung-Boo Jung (Microelectron. Reliab., 2014)