A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending. - Leon Xu; Tommi Reinikainen; Wei Ren; Bo Ping Wang; Zhenxue Han; Dereje Agonafer (Microelectron. Reliab., 2004)

Global optimization of non-convex piecewise linear regression splines. - Nadia Martinez; Hadis Anahideh; Jay M. Rosenberger; Diana Martinez; Victoria C. P. Chen; Bo Ping Wang (J. Glob. Optim., 2017)