Reliability Evaluation of Multi-Mechanism Failure for Semiconductor Devices Using Physics-of-Failure Technique and Maximum Entropy Principle. - Bo Wan 001; Ye Wang; Yutai Su; Guicui Fu (IEEE Access, 2020)

Research on IGBT Bonding Wires Crack Propagation at the Macro and Micro Scales. - Jun Luo; Shukai Guan; Bo Wan 001; Maogong Jiang; Guicui Fu (IEEE Access, 2021)

PRNU Estimation of Linear CMOS Image Sensors That Allows Nonuniform Illumination. - Ye Wang; Bo Wan 001; Guicui Fu; Yutai Su (IEEE Trans. Instrum. Meas., 2021)

Research on BHAST Test Method for Plastic Encapsulated Microcircuit. - Yuege Zhou; Bo Wan 001; Qingsheng Liu; Jingyang Zhong; Shupeng Li; Tengfei Ma; Wei Guo (IEEE Access, 2025)