Nickel-palladium bond pads for copper wire bonding. - Horst Clauberg; Petra Backus; Bob Chylak (Microelectron. Reliab., 2011)

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. - Adeline B. Y. Lim; Andrew C. K. Chang; Oranna Yauw; Bob Chylak; Chee Lip Gan; Zhong Chen 004 (Microelectron. Reliab., 2014)

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution. - Adeline B. Y. Lim; Chris B. Boothroyd; Oranna Yauw; Bob Chylak; Chee Lip Gan; Zhong Chen 004 (Microelectron. Reliab., 2016)

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition. - Adeline B. Y. Lim; Wei Jian Neo; Oranna Yauw; Bob Chylak; Chee Lip Gan; Zhong Chen 004 (Microelectron. Reliab., 2016)