Intrinsic capacitance extraction and estimation for system-on-chip power delivery development. - Li Chuang Quek; Bok Eng Cheah; Wai Ling Lee; Weng Chong Sam (APCCAS, 2012)

Study of dielectric material property impact on insertion loss for advanced packaging solutions. - Bok Eng Cheah; H. Louis Lo; Jackson Kong (ICCE-TW, 2015)