Thermal aware timing budget for buffer insertion in early stage of physical design. - Minbeom Kim; Byung-Gyu Ahn; Jaehwan Kim; Bongki Lee; Jong-Wha Chong (ISCAS, 2012)

A novel methodology for power delivery network optimization in 3-D ICs using through-silicon-via technology. - Bongki Lee; Byung-Gyu Ahn; Jaehwan Kim; Minbeom Kim; Jong-Wha Chong (ISCAS, 2012)