Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry. - Jinwon Joo; Seungmin Cho; Bongtae Han (Microelectron. Reliab., 2005)

On the applicability of MIL-Spec-based helium fine leak test to packages with sub-micro liter cavity volumes. - Arindam Goswami; Bongtae Han (Microelectron. Reliab., 2008)

Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages. - Changsoo Jang; Byeng Dong Youn; Ping F. Wang; Bongtae Han; Suk-Jin Ham (Microelectron. Reliab., 2010)

Life prediction of LED-based recess downlight cooled by synthetic jet. - Bong-Min Song; Bongtae Han; Avram Bar-Cohen; Mehmet Arik; Rajdeep Sharma; Stan Weaver (Microelectron. Reliab., 2012)

Measurements of True Leak Rates of MEMS Packages. - Bongtae Han (Sensors, 2012)

Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability. - Bong-Min Song; Bongtae Han; Joon-Hyun Lee (Microelectron. Reliab., 2013)

Degradation analysis of secondary lens system and its effect on performance of LED-based luminaire. - Dae-Suk Kim; Bongtae Han; Youn-Jea Kim (Microelectron. Reliab., 2014)

Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages. - Kenny Mahan; Byung Kim; Bulong Wu; Bongtae Han; Ilho Kim; Hojeong Moon; Young Nam Hwang (Microelectron. Reliab., 2016)

In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor. - Alicja Palczynska; Przemyslaw Jakub Gromala; Dirk Mayer; Bongtae Han; Tobias Melz (Microelectron. Reliab., 2016)

Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor. - Alicja Palczynska; Alexandru Prisacaru; Przemyslaw Jakub Gromala; Bongtae Han; Dirk Mayer; Tobias Melz (Microelectron. Reliab., 2017)

Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method. - Hsiu-Ping Wei; Bongtae Han; Byeng Dong Youn; Hyuk Shin; Ilho Kim; Hojeong Moon (Microelectron. Reliab., 2017)

Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach. - Alexandru Prisacaru; Przemyslaw Jakub Gromala; Bongtae Han; Guoqi Zhang (IEEE Trans. Ind. Electron., 2022)

A Simple but Effective Way to Handle Rotating Machine Fault Diagnosis With Imbalanced-Class Data: Repetitive Learning Using an Advanced Domain Adaptation Model. - Donghwi Yoo; Minseok Choi; Hyunseok Oh; Bongtae Han (IEEE Access, 2024)