Thermal conduction path analysis in 3-D ICs. - Boris Vaisband; Ioannis Savidis; Eby G. Friedman (ISCAS, 2014)

3-D floorplanning algorithm to minimize thermal interactions. - Boris Vaisband; Eby G. Friedman (ISCAS, 2015)

Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits. - Ioannis Savidis; Boris Vaisband; Eby G. Friedman (IEEE Trans. Very Large Scale Integr. Syst., 2015)

Layer ordering to minimize TSVs in heterogeneous 3-D ICs. - Boris Vaisband; Eby G. Friedman (ISCAS, 2016)

Noise Coupling Models in Heterogeneous 3-D ICs. - Boris Vaisband; Eby G. Friedman (IEEE Trans. Very Large Scale Integr. Syst., 2016)

Hybrid energy harvesting in 3-D IC IoT devices. - Boris Vaisband; Eby G. Friedman (ISCAS, 2017)

Hexagonal TSV Bundle Topology for 3-D ICs. - Boris Vaisband; Eby G. Friedman (IEEE Trans. Circuits Syst. II Express Briefs, 2017)

Network on interconnect fabric. - Boris Vaisband; Adeel Ahmad Bajwa; Subramanian S. Iyer (ISQED, 2018)

Heterogeneous 3-D ICs as a platform for hybrid energy harvesting in IoT systems. - Boris Vaisband; Eby G. Friedman (Future Gener. Comput. Syst., 2018)

Reliability Evaluation of Silicon Interconnect Fabric Technology. - Kannan K. Thankappan; Adeel Ahmad Bajwa; Boris Vaisband; SivaChandra Jangam; Subramanian S. Iyer (IRPS, 2019)

Global and semi-global communication on Si-IF. - Boris Vaisband; Subramanian S. Iyer (NOCS, 2019)

Communication Considerations for Silicon Interconnect Fabric. - Boris Vaisband; Subramanian S. Iyer (SLIP, 2019)

Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems. - Subramanian S. Iyer; SivaChandra Jangam; Boris Vaisband (IBM J. Res. Dev., 2019)

Multi-Bit CNT TSV for 3-D ICs. - Boris Vaisband; Ange Maurice; Chong Wei Tan; Beng Kang Tay; Eby G. Friedman (ISCAS, 2020)

Power Delivery for Silicon Interconnect Fabric. - Yousef Safari; Boris Vaisband (ISCAS, 2021)

Power Delivery for Ultra-Large-Scale Applications on Si-IF. - Yousef Safari; Anja Kroon; Boris Vaisband (ISCAS, 2022)

Integrated Power Delivery Methodology for 3D ICs. - Yousef Safari; Boris Vaisband (ISQED, 2022)

A 7.6-ns Delay Subthreshold Level-Shifter Leveraging a Composite Transistor and a Voltage-Controlled Current Source. - Mousa Karimi; Mohamed Ali 001; Ahmad Hassan; Reza Bostani; Boris Vaisband; Mohamad Sawan; Benoit Gosselin (IEEE Access, 2022)

Hybrid Obfuscation of Chiplet-Based Systems. - Yousef Safari; Pooya Aghanoury; Subramanian S. Iyer; Nader Sehatbakhsh; Boris Vaisband (DAC, 2023)

Statistical Weight Refresh System for CTT-Based Synaptic Arrays. - Samuel Dayo; Ataollah Saeed Monir; Mousa Karimi; Boris Vaisband (ACM Great Lakes Symposium on VLSI, 2023)

Digital LIF Neuron for CTT-Based Neuromorphic Systems. - Okyanus T. Gumus; Mousa Karimi; Boris Vaisband (ACM Great Lakes Symposium on VLSI, 2023)

P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs. - Dima Al Saleh; Yousef Safari; Fahad Rahman Amik; Boris Vaisband (SOCC, 2023)

CTT-Based Scalable Neuromorphic Architecture. - Mousa Karimi; Ataollah Saeed Monir; Rezvan Mohammadrezaee; Boris Vaisband (IEEE J. Emerg. Sel. Topics Circuits Syst., 2023)

A Robust Integrated Power Delivery Methodology for 3-D ICs. - Yousef Safari; Boris Vaisband (IEEE Trans. Very Large Scale Integr. Syst., 2023)

Co-DTC: Concentric Trench-Based Integrated Capacitors for Advanced Chiplet-Based Platforms. - Yousef Safari; Yushu Zhao; Boris Vaisband (ACM Great Lakes Symposium on VLSI, 2024)

Graph-Based Timing Prediction at Early-Stage RTL Using Large Language Model. - Fahad Rahman Amik; Yousef Safari; Zhanguang Zhang; Boris Vaisband (ASP-DAC, 2025)

Invited: Chiplet-Based Integration - Scale-Down and Scale-Out. - Boris Vaisband (ISPD, 2025)

Behavioral Model of Charge-Trap Transistors for Neuromorphic Systems. - Ataollah Saeed Monir; Navid Rezazadeh; John Gosson; Boris Vaisband (ISQED, 2025)

Thermal Simulator for Advanced Packaging and Chiplet-Based Systems. - Yousef Safari; Adam Corbier; Dima Al Saleh; Fahad Rahman Amik; Boris Vaisband (IEEE Trans. Very Large Scale Integr. Syst., 2025)