Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach. - Brent Goplen; Sachin S. Sapatnekar (ICCAD, 2003)

Net weighting to reduce repeater counts during placement. - Brent Goplen; Prashant Saxena; Sachin S. Sapatnekar (DAC, 2005)

Thermal via placement in 3D ICs. - Brent Goplen; Sachin S. Sapatnekar (ISPD, 2005)

Placement and Routing in 3D Integrated Circuits. - Cristinel Ababei; Yan Feng; Brent Goplen; Hushrav Mogal; Tianpei Zhang; Kia Bazargan; Sachin S. Sapatnekar (IEEE Des. Test Comput., 2005)

Electrothermal analysis and optimization techniques for nanoscale integrated circuits. - Yong Zhan; Brent Goplen; Sachin S. Sapatnekar (ASP-DAC, 2006)

Temperature-Aware Placement for SOCs. - Jeng-Liang Tsai; Charlie Chung-Ping Chen; Guoqiang Chen; Brent Goplen; Haifeng Qian; Yong Zhan; Sung-Mo Kang; Martin D. F. Wong; Sachin S. Sapatnekar (Proc. IEEE, 2006)

Placement of Thermal Vias in 3-D ICs Using Various Thermal Objectives. - Brent Goplen; Sachin S. Sapatnekar (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2006)

Placement of 3D ICs with Thermal and Interlayer Via Considerations. - Brent Goplen; Sachin S. Sapatnekar (DAC, 2007)