Printed electronics for low-cost electronic systems: Technology status and application development. - Vivek Subramanian; Josephine B. Chang; Alejandro de la Fuente Vornbrock; Daniel C. Huang; Lakshmi Jagannathan; Frank Liao; Brian Mattis; Steven E. Molesa; David R. Redinger; Daniel Soltman; Steven K. Volkman; Qintao Zhang (ESSCIRC, 2008)

High density backside tungsten TSV for 3D stacked ICs. - Reynard Blasa; Brian Mattis; Dave Martini; Sidi Lanee; Carl Petteway; Sangki Hong; Kangsoo Yi (3DIC, 2016)

Front-side mid-level Tungsten TSV integration for high-density 3D applications. - Brian Mattis; Lovelace Soirez; Catherine Bullock; Dave Martini; Sara Jensen; James Levy; Adam Jones (3DIC, 2016)