Best engineering practice for thermal characterization of stacked dice FPGA devices. - Arun Raghupathy; Hoa Do; Brian Philofsky; Gamal Refai-Ahmed (3DIC, 2015)

A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications. - Gamal Refai-Ahmed; Ivor Barber; Anthony Torza; Brian Philofsky (3DIC, 2015)