Chip to wafer copper direct bonding electrical characterization and thermal cycling. - Yann Beilliard; Perceval Coudrain; Léa Di Cioccio; Stéphane Moreau; Loic Sanchez; Brigitte Montmayeul; Thomas Signamarcheix; Rafael Estevez; Guillaume Parry (3DIC, 2013)

High-Speed Heterogeneous InP-on-Si Capacitive Phase Modulators. - Sylvie Menezo; Torrey Thiessen; Philippe Grosse; Joyce K. S. Poon; Christophe Jany; Jeremy Da Fonseca; Bertrand Szelag; Benoît Charbonnier; Georgio El-Zammar; Olivier Lemonnier; Patricia Bilondeau; Stephane Malhouitre; et al. (OFC, 2018)