Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. - Jonghoon J. Kim; Heegon Kim; Sukjin Kim; Bumhee Bae; Daniel H. Jung; Sunkyu Kong; Joungho Kim; Junho Lee; Kunwoo Park (3DIC, 2013)

Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment. - Bumhee Bae; Sunkyu Kong; Jonghoon J. Kim; Sukjin Kim; Joungho Kim (EMC Compo, 2013)

Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. - Jonghoon J. Kim; Heegon Kim; Sukjin Kim; Bumhee Bae; Daniel H. Jung; Sunkyu Kong; Joungho Kim; Junho Lee; Kunwoo Park (EMC Compo, 2013)

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. - Jonghoon J. Kim; Bumhee Bae; Sukjin Kim; Sunkyu Kong; Heegon Kim; Daniel H. Jung; Joungho Kim (3DIC, 2014)

Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems. - Sung Joo Park; Bumhee Bae; Joungho Kim; Madhavan Swaminathan (IEEE Trans. Very Large Scale Integr. Syst., 2017)

Proposal of Flat-coaxial Cable Structure and its Design Methodology based on FPCB process for 5G application. - Bumhee Bae; Younho Kim; Minseok Kim; Youngkun Kwon; Jeongnam Cheon (ICCE, 2019)