Highly-Doped Through-Contact Silicon Epi Design at 3 nm node. - Sushant Mittal; Ashish Pal; Mehdi Saremi; J. Ferrell; M. Haverty; T. Miyashita; N. Kim; El Mehdi Bazizi; Blessy Alexander; A. B. Sachid; Buvna Ayyagari (DRC, 2019)

Modeling and Optimization of Advanced 3D NAND Memory. - Mehdi Saremi; Ashish Pal; Liu Jiang; El Mehdi Bazizi; Helen Lee; Xi-Wei Lin; Blessy Alexander; Buvna Ayyagari-Sangamalli (DRC, 2020)

Integration scheme for 3D NAND with nonreplacement word line and its cell characteristics investigation. - Liu Jiang; Chang Seok Kang; Ashish Pal; El Mehdi Bazizi; Tomohiko Kitajima; Nancy Fung; Gabriela Alva; Amy Child; Bhaskar Bhuyan; Takehito Koshizawa; Sung-Kwan Kang; Gill Lee; et al. (IMW, 2021)

A Fully Integrated System-on-Chip Design with Scalable Resistive Random-Access Memory Tile Design for Analog in-Memory Computing. - Fuxi Cai; She-Hwa Yen; Apurva Uppala; Luke Thomas; Tianchi Liu 003; Peter Fu; Xiaofeng Zhang; Ambrose Low; Deepak Kamalanathan; Joe Hsu; Buvna Ayyagari-Sangamalli (Adv. Intell. Syst., 2022)

BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond. - Gaurav Thareja; Ashish Pal; Xingye Wang; Sefa Dag; Shi You; Shashank Sharma; Qing Zhu; Carmen L. Cervantes; Shinjae Hwang; Matthew Spuller; Ben Ng; Pradeep S. Kumar; et al. (VLSI Technology and Circuits, 2023)

Bulk-Switching Memristor-based Compute-In-Memory Module for Deep Neural Network Training. - Yuting Wu; Qiwen Wang; Ziyu Wang; Xinxin Wang 002; Buvna Ayyagari; Siddarth A. Krishnan; Michael Chudzik; Wei D. Lu (CoRR, 2023)