Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices. - Myeong-Hyeok Jeong; Jae-Won Kim; Byung-Hyun Kwak; Young-Bae Park; Byoung-Joon Kim; Young-Chang Joo (BIODEVICES, 2011)

Technology Licensing and the Performance of Firms in US Information and Communication Technology Industry: The Case of Licensees. - YoungJun Kim; Eui-Young Lee; Beom Cheol Cin; Byoung-Joon Kim (KSII Trans. Internet Inf. Syst., 2014)

Political efficacy, community collective efficacy, trust and extroversion in the information society: Differences between online and offline civic/political activities. - Byoung-Joon Kim (Gov. Inf. Q., 2015)

Public Officials' Attitudes toward Data-Driven Government: Exploring the Differences between Managers and Practitioners in the South Korean Government. - Minsu Ra; Byoung-Joon Kim (DG.O, 2024)

Assessing the Role of Yarn Placement in Plated Knit Strain Sensors: A Detailed Study of Their Electromechanical Properties and Applicability in Bending Cycle Monitoring. - Youn-Hee Kim; Juwon Jun; You-Kyung Oh; Hee-Ji Choi; Mi-Jung Lee; Kyeong-Sik Min; Sung-Hyon Kim; Hyunseung Lee 004; Ho-Seok Nam; Son Singh; Byoung-Joon Kim; Jaegab Lee (Sensors, 2024)