Current stressing effect on interfacial reaction characteristics of Cu pillar/Sn-3.5Ag microbumps for 3D integration. - Byung-Hyun Kwak; Sung-Hyuk Kim; Young-Bae Park (3DIC, 2011)

Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices. - Myeong-Hyeok Jeong; Jae-Won Kim; Byung-Hyun Kwak; Young-Bae Park; Byoung-Joon Kim; Young-Chang Joo (BIODEVICES, 2011)