Optimal allocation and placement of thermal sensors for reconfigurable systems and its practical extension. - Byunghyun Lee 002; Taewhan Kim (ASP-DAC, 2008)

High-level TSV resource sharing and optimization for TSV based 3D IC designs. - Byunghyun Lee 002; Taewhan Kim (SoCC, 2013)

Algorithms for TSV resource sharing and optimization in designing 3D stacked ICs. - Byunghyun Lee 002; Taewhan Kim (Integr., 2014)