Board level reliability of a stacked CSP subjected to cyclic bending. - J. D. Wu; S. H. Ho; C. Y. Huang; C. C. Liao; P. J. Zheng; S. C. Hung (Microelectron. Reliab., 2002)

Fracture strength characterization and failure analysis of silicon dies. - J. D. Wu; C. Y. Huang; C. C. Liao (Microelectron. Reliab., 2003)