Use of optical metrology for wafer level packaging of CMOS image sensor. - D. Le Cunff; A. Pravdivtsev; K. Le Chao; C. Euvrard; Emilie Deloffre; A. Cailean (3DIC, 2010)

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. - Ionut Radu; Didier Landru; Gweltaz Gaudin; Gregory Riou; Catherine Tempesta; Fabrice Letertre; Léa Di Cioccio; Pierric Gueguen; Thomas Signamarcheix; C. Euvrard; Jérôme Dechamp; Laurent Clavelier; et al. (3DIC, 2010)

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. - Lucile Arnaud; Stéphane Moreau; Amadine Jouve; Imed Jani; Didier Lattard; F. Fournel; C. Euvrard; Y. Exbrayat; Viorel Balan; Nicolas Bresson; S. Lhostis; J. Jourdon; et al. (IRPS, 2018)