Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. - C. F. Luk; Y. C. Chan; K. C. Hung (Microelectron. Reliab., 2002)

Application of adhesive bonding techniques in hard disk drive head assembly. - C. F. Luk; Y. C. Chan; K. C. Hung (Microelectron. Reliab., 2002)