Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process. - C. F. Tsang; V. N. Bliznetsov; Y. J. Su (Microelectron. J., 2003)

Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. - C. F. Tsang; C. Y. Li; A. Krishnamoorthy; Y. J. Su; H. Y. Li; L. Y. Wong; W. H. Li; L. J. Tang; K. Y. Ee (Microelectron. J., 2004)

Process improvement of 0.13mum Cu/Low K (Black DiamondTM) dual damascene interconnection. - H. Y. Li; Y. J. Su; C. F. Tsang; S. M. Sohan; V. N. Bliznetsov; L. Zhang (Microelectron. Reliab., 2005)

A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections. - C. F. Tsang; C. K. Chang; A. Krishnamoorthy; K. Y. Ee; Y. J. Su; H. Y. Li; W. H. Li; L. Y. Wong (Microelectron. Reliab., 2005)