Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. - Sylvain Joblot; Alexis Farcy; Nicolas Hotellier; Amadine Jouve; François de Crecy; Arnaud Garnier; M. Argoud; C. Ferrandon; J.-P. Colonna; R. Franiatte; C. Laviron; Séverine Cheramy (3DIC, 2013)

A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications. - Y. Lamy; Laurent Dussopt; Ossama El Bouayadi; C. Ferrandon; Alexandre Siligaris; Cedric Dehos; Pierre Vincent (3DIC, 2013)