Automated extraction of SPICE circuit models from symbolic gate matrix layout with pruning. - R. D. Freeman; S. M. Kang; C. G. Lin-Hendel; M. L. Newby (DAC, 1986)

Integrated optoelectronics-to-VLSI packaging technology. - C. G. Lin-Hendel; W. J. Bertram; M. S. Dhanaliwala; R. J. Pimpinella; J. M. Segelken; King L. Tai (ICCD, 1989)

The design of a multi-chip single package digital signal processing module. - C. G. Lin-Hendel; L. H. Cong (ICCD, 1989)

Accurate interconnect modeling for high frequency LSI/VLSI circuits and systems. - C. G. Lin-Hendel (ICCD, 1990)