Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability. - D. S. Liu; Y. C. Chao; C. H. Lin; G. S. Shen; H. S. Liu (Microelectron. Reliab., 2003)

Study of sub-5 nm RRAM, tunneling selector and selector less device. - Kai-Shin Li; Ming-Taou Lee; Min-Cheng Chen; Cho-Lun Hsu; J. M. Lu; C. H. Lin; C. C. Chen; B. W. Wu; Y. F. Hou; C. Yi. Lin; Y. J. Chen; T. Y. Lai; et al. (ISCAS, 2015)

Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability. - Ming-Yi Tsai; P. S. Huang; C. H. Lin; C. T. Wu; S. C. Hu (Microelectron. Reliab., 2015)

Mitigation of voltage variation by REMS for distribution feeders. - C. C. Yeh; Chao Shun Chen; T. T. Ku; C. H. Lin; Cheng Ting Hsu; Hui-Jen Chuang (IAS, 2016)

Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications. - Ming-Yi Tsai; C. H. Lin; K. F. Chuang; Y. H. Chang; C. T. Wu; S. C. Hu (Microelectron. Reliab., 2016)

Transformer management system for energy control of customer demand response and PV systems. - T. T. Ku; Chao Shun Chen; C. H. Lin; Cheng Ting Hsu (IAS, 2017)

Sub-ns Access Sub-mW/GHz 32 Kb SRAM with 0.45 V Cross-Point-5T Cell and Built-in Y_ Line. - C. Y. He; K. H. Tang; T. S. Chen; K. Y. Chang; C. H. Lin; K. Sato; Shyh-Jye Jou; P. H. Chen; H. M. Chen; B. D. Rong; K. Itoh (A-SSCC, 2019)

Enhancing 3D XPT/SOM Reliability: Strategies for Mitigating Spike Current and Improving Read Endurance. - C. L. Sung; D. Daudelin; Wei-Chih Chien; R. C. Jordan; S. Cheng; Lynne M. Gignac; Douglas M. Bishop; C. W. Yeh; L. Buzi; C. W. Cheng; J. X. Zheng; E. K. Lai; et al. (IMW, 2025)