Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D IC. - C. Hemanth Kumar; Asisa Kumar Panigrahi; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration. - Suraj Patil; Asisa Kumar Panigrahi; Satish Bonam; C. Hemanth Kumar; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)