C. J. Hang
According to our database1, C. J. Hang
Legend:Book In proceedings Article PhD thesis Other
Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound.
Microelectronics Reliability, 2011
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging.
Microelectronics Reliability, 2008