Cu pumping in TSVs: Effect of pre-CMP thermal budget. - Ingrid De Wolf; Kris Croes; O. Varela Pedreira; Riet Labie; Augusto Redolfi; M. Van De Peer; Kris Vanstreels; C. Okoro; Bart Vandevelde; Eric Beyne (Microelectron. Reliab., 2011)