Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity. - Toni Youssef; W. Rmili; Eric Woirgard; Stephane Azzopardi; N. Vivet; D. M. Meekhof; Régis Meuret; G. Le Quilliec; C. Richard (Microelectron. Reliab., 2015)