Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates. - Yi-Wun Wang; Y. W. Lin; C. Robert Kao (Microelectron. Reliab., 2009)

Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding. - Jiunn Chen; Yi-Shao Lai; Yi-Wun Wang; C. Robert Kao (Microelectron. Reliab., 2011)

Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics. - Y. J. Chen; C. K. Chung; C. R. Yang; C. Robert Kao (Microelectron. Reliab., 2013)

Reliability of micro-interconnects in 3D IC packages. - C. Robert Kao; Albert T. Wu; King-Ning Tu; Yi-Shao Lai (Microelectron. Reliab., 2013)

Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration. - Akitsu Shigetou; Tilo H. Yang; C. Robert Kao (3DIC, 2019)

Low-Cost Sensor-Rich Fluidic Elastomer Actuators Embedded with Paper Electronics. - Tilo H. Yang; Jun Shintake; Ryo Kanno; C. Robert Kao; Jun Mizuno (Adv. Intell. Syst., 2020)