Reliability challenges for 2.5D/3D integration: An overview. - C. S. Premachandran; Seungman Choi; Salvatore Cimino; Thuy Tran-Quinn; Lloyd Burrell; Patrick Justison (IRPS, 2018)

A Comprehensive Wafer Level Reliability Study on 65nm Silicon Interposer. - C. S. Premachandran; Thuy Tran-Quinn; Lloyd Burrell; Patrick Justison (IRPS, 2019)