Correlation studies for component level ball impact shear test and board level drop test. - Ee-Hua Wong; Ranjan Rajoo; S. K. W. Seah; C. S. Selvanayagam; W. D. van Driel; J. F. J. M. Caers; X. J. Zhao; N. Owens; L. C. Tan; M. Leoni; P. L. Eu; Y.-S. Lai; et al. (Microelectron. Reliab., 2008)

A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications. - Xiaowu Zhang; Ranjan Rajoo; F. X. Che; C. S. Selvanayagam; W. K. Choi; Shan Gao; Guo-Qiang Lo; Dim-Lee Kwong (3DIC, 2011)

Constitutive modeling of solder alloys for drop-impact applications. - Ee-Hua Wong; J. Chrisp; C. S. Selvanayagam; S. K. W. Seah (Microelectron. Reliab., 2016)