Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. - Cheng-Ta Ko; Zhi-Cheng Hsiao; Y. J. Chang; Peng-Shu Chen; J. H. Huang; Hsin-Chia Fu; Y. J. Huang; C. W. Chiang; W. L. Tsat; Y. H. Chen; Wei-Chung Lo; Kuan-Neng Chen (3DIC, 2011)