Board level reliability of a stacked CSP subjected to cyclic bending. - J. D. Wu; S. H. Ho; C. Y. Huang; C. C. Liao; P. J. Zheng; S. C. Hung (Microelectron. Reliab., 2002)

Fracture strength characterization and failure analysis of silicon dies. - J. D. Wu; C. Y. Huang; C. C. Liao (Microelectron. Reliab., 2003)

Intelligent Call Admission Control for Wideband CDMA Cellular Systems. - S. Shen; C.-J. Chang; C. Y. Huang; Q. Bi (IEEE Trans. Wirel. Commun., 2004)

Impact of Social Behaviors on HIV Epidemic: A Computer Simulation View. - C. Sumodhee; J. L. Hsieh; C. T. Sun; C. Y. Huang; Arthur Y. M. Chen (CIMCA/IAWTIC, 2005)

Minimizing the Total Completion Time for the TFT-Array Factory Scheduling Problem (TAFSP). - Amy H. I. Lee; S. H. Chung; C. Y. Huang (ICCSA (1), 2007)

Testing process precision for truncated normal distributions. - Wen Lea Pearn; H. N. Hung; N. F. Peng; C. Y. Huang (Microelectron. Reliab., 2007)

Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. - Ming-Yi Tsai; C. W. Ting; C. Y. Huang; Yi-Shao Lai (Microelectron. Reliab., 2011)

An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages. - Ming-Yi Tsai; P. S. Huang; C. Y. Huang; P. C. Lin; Lawrence Huang; Michael Chang; Steven Shih; J. P. Lin (Microelectron. Reliab., 2014)