Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. - Cadmus A. Yuan; Willem D. van Driel; Richard B. R. van Silfhout; Olaf van der Sluis; Roy A. B. Engelen; Leo J. Ernst; Fred van Keulen; G. Q. Zhang (Microelectron. Reliab., 2006)

Mechanical reliability challenges for MEMS packages: Capping. - Willem D. van Driel; Dao-Guo Yang; Cadmus A. Yuan; M. van Kleef; G. Q. (Kouchi) Zhang (Microelectron. Reliab., 2007)

Molecular simulation on the material/interfacial strength of the low-dielectric materials. - Cadmus A. Yuan; Olaf van der Sluis; G. Q. (Kouchi) Zhang; Leo J. Ernst; Willem D. van Driel; Richard B. R. van Silfhout (Microelectron. Reliab., 2007)

The need for multi-scale approaches in Cu/low-k reliability issues. - Cadmus A. Yuan; Olaf van der Sluis; Willem D. van Driel; G. Q. (Kouchi) Zhang (Microelectron. Reliab., 2008)

Thermal and mechanical effects of voids within flip chip soldering in LED packages. - Yang Liu 103; Stanley Y. Y. Leung; Jia Zhao; Cell K. Y. Wong; Cadmus A. Yuan; Guoqi Zhang; Fenglian Sun; Liangliang Luo (Microelectron. Reliab., 2014)

Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes. - Huaiyu Ye; Bo Li; Hongyu Tang; Jia Zhao; Cadmus A. Yuan; Guoqi Zhang (Microelectron. Reliab., 2014)

Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes. - Yang Liu 103; Fenglian Sun; Hao Zhang 034; Tong Xin; Cadmus A. Yuan; Guoqi Zhang (Microelectron. Reliab., 2015)

An accelerated test method of luminous flux depreciation for LED luminaires and lamps. - C. Qian; X. J. Fan; J. J. Fan; Cadmus A. Yuan; Guo Qi Zhang (Reliab. Eng. Syst. Saf., 2016)