Opportunities brought by sequential 3D CoolCube™ integration. - Maud Vinet; Perrine Batude; Claire Fenouillet-Béranger; Laurent Brunet; Vincent Mazzocchi; Cao-Minh Vincent Lu; Fabien Deprat; Jessy Micout; Bernard Previtali; Paul Besombes; Nils Rambal; François Andrieu; et al. (ESSDERC, 2016)

Recent advances in 3D VLSI integration. - Claire Fenouillet-Béranger; Perrine Batude; Laurent Brunet; Vincent Mazzocchi; Cao-Minh Vincent Lu; Fabien Deprat; Jessy Micout; M.-P. Samson; Bernard Previtali; Paul Besombes; Nils Rambal; François Andrieu; et al. (ICICDT, 2016)

Precise EOT regrowth extraction enabling performance analysis of low temperature extension first devices. - Jessy Micout; Quentin Rafhay; Xavier Garros; Mikaël Cassé; Jean Coignus; Luca Pasini; Cao-Minh Vincent Lu; Nils Rambal; Claire Fenouillet-Béranger; Laurent Brunet; G. Romano; R. Gassilloud; et al. (ESSDERC, 2017)

Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells. - Melanie Brocard; Benoît Mathieu; Jean-Philippe Colonna; Cristiano Santos; Claire Fenouillet-Béranger; Cao-Minh Vincent Lu; Gerald Cibrario; Laurent Brunet; Perrine Batude; François Andrieu; Sébastien Thuries; Olivier Billoint (ISVLSI, 2017)