Test structure assembly for bump bond yield measurement on high density flip chip technologies. - Miguel Ullán; Manuel Lozano 003; Mokhtar Chmeissani; G. Blanchot; Enric Cabruja; J. García; M. Maiorino; Ricardo Martínez; Giulio Pellegrini; Carles Puigdengoles (Microelectron. Reliab., 2006)

Simulation of the Expected Performance of a Seamless Scanner for Brain PET Based on Highly Pixelated CdTe Detectors. - Ekaterina Mikhaylova; Gianluca De Lorenzo; Mokhtar Chmeissani; Machiel Kolstein; Mario Cañadas; Pedro Arce; Yonatan Calderon; Dilber Uzun; Gerard Arino; José Gabriel Macias-Montero; Ricardo Martínez; Carles Puigdengoles; et al. (IEEE Trans. Medical Imaging, 2014)