Application of three-parameter lognormal distribution in EM data analysis. - Baozhen Li; Emmanuel Yashchin; Cathryn Christiansen; Jason Gill; Ronald Filippi; Timothy D. Sullivan (Microelectron. Reliab., 2006)

Electromigration challenges for advanced on-chip Cu interconnects. - Baozhen Li; Cathryn Christiansen; Dinesh Badami; Chih-Chao Yang (Microelectron. Reliab., 2014)

Diagnostic electromigration reliability evaluation with a local sensing structure. - Fen Chen; Erik McCullen; Cathryn Christiansen; Michael A. Shinosky; Roger Dufresne; Prakash Periasamy; Rick Kontra; Carole Graas; Gary StOnge (IRPS, 2015)

Effect of metal line width on electromigration of BEOL Cu interconnects. - Seungman Choi; Cathryn Christiansen; Linjun Cao; James Zhang; Ronald Filippi; Tian Shen; Kong Boon Yeap; Sean P. Ogden; Haojun Zhang; Bianzhu Fu; Patrick Justison (IRPS, 2018)

Electromigration characteristics of power grid like structures. - Baozhen Li; Andrew Kim; Paul McLaughlin; Barry P. Linder; Cathryn Christiansen (IRPS, 2018)

New insight on TDDB area scaling methodology of non-Poisson systems. - Tian Shen; Kong Boon Yeap; Sean P. Ogden; Cathryn Christiansen; Patrick Justison (IRPS, 2018)