Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. - Lionel Cadix; Alexis Farcy; Cédric Bermond; Christine Fuchs; Patrick Leduc; Maxime Rousseau; Myriam Assous; Alexandre Valentian; Julie Roullard; Elie Eid; Nicolas Sillon; Bernard Fléchet; et al. (3DIC, 2009)

Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking. - Elie Eid; Thierry Lacrevaz; Sébastien de Rivaz; Cédric Bermond; Bernard Fléchet; Françis Calmon; Christian Gontrand; Alexis Farcy; Lionel Cadix; Pascal Ancey (3DIC, 2009)

RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits. - Melanie Brocard; Cédric Bermond; Thierry Lacrevaz; Alexis Farcy; Patrick Le Maitre; P. Scheer; Patrick Leduc; Séverine Cheramy; Bernard Fléchet (3DIC, 2013)

Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer. - Khadim Dieng; Philippe Artillan; Cédric Bermond; Olivier Guiller; Thierry Lacrevaz; Sylvain Joblot; Gregory Houzet; Alexis Farcy; Yann Lamy; Bernard Fléchet (3DIC, 2014)

In-situ characterization up to 100 ​GHz of insulators used in new 3D "System in Package on board" (SiPoB) technologies. - Gregory Houzet; Thierry Lacrevaz; Cédric Bermond; Philippe Artillan; David Auchère; Laurent Schwarz; Bernard Fléchet (Microelectron. J., 2021)

A Microwave Frequency Range Experiment for the Measurement of Snow Density and Liquid Water Content. - Cédric Bermond; Philippe Artillan; Michel Gay (IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens., 2021)