3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). - Jan Van Olmen; Jan Coenen; Wim Dehaene; Kristin De Meyer; Cedric Huyghebaert; Anne Jourdain; Guruprasad Katti; Abdelkarim Mercha; Michal Rakowski; Michele Stucchi; Youssef Travaly; Eric Beyne; et al. (3DIC, 2009)

Hybrid graphene-silicon photonics devices. - Dries Van Thourhout; Yingtao Hu; Marianna Pantouvaki; Koen Alexander; Bart Kuyken; Steven Brems; Inge Asselberghs; Cedric Huyghebaert; Chiara Alessandri; Philippe Absil; Joris Van Campenhout (ECOC, 2015)

Tunneling transistors based on MoS2/MoTe2 Van der Waals heterostructures. - Yashwanth Balaji; Quentin Smets; Cesar J. Lockhart de la Rosa; Anh Khoa Augustin Lu; Daniele Chiappe; Tarun Agarwal; Dennis Lin; Cedric Huyghebaert; Iuliana P. Radu; Dan Mocuta; Guido Groeseneken (ESSDERC, 2017)

WS2 transistors on 300 mm wafers with BEOL compatibility. - Tom Schram; Quentin Smets; Benjamin Groven; M. H. Heyne; E. Kunnen; A. Thiam; Katia Devriendt; Annelies Delabie; Dennis Lin; M. Lux; Daniele Chiappe; I. Asselberghs; et al. (ESSDERC, 2017)

Broadband 20 Gbit/s Graphene-Si Electro-Absorption Modulator. - Chiara Alessandri; Inge Asselberghs; Yoojin Ban; Steven Brems; Cedric Huyghebaert; Joris Van Campenhout; Dries Van Thourhout; Marianna Pantouvaki (ECOC, 2018)

4-Channel C-Band WDM Transmitter Based on 10 GHz Graphene-Silicon Electro-Absorption Modulators. - Chiara Alessandri; Inge Asselberghs; Peter De Heyn; Steven Brems; Cedric Huyghebaert; Joris Van Campenhout; Dries Van Thourhout; Marianna Pantouvaki (OFC, 2019)

Graphene electro-absorption modulators integrated at wafer-scale in a CMOS fab. - Cheng Han Wu; Steven Brems; Didit Yudistira; Daire Cott; A. Milenin; Kevin Vandersmissen; A. Maestre; A. Centeno; Joris Van Campenhout; Cedric Huyghebaert; Marianna Pantouvaki (VLSI Circuits, 2021)