Development of Embedded Three-Dimensional 35-nF/mm2 MIM Capacitor and BiCMOS Circuits Characterization. - Jean-Christophe Giraudin; Franck Badets; Jean-Pierre Blanc; Emmanuel Chataigner; Cédrick Chappaz; Jorge Luis Regolini; Philippe Delpech (IEEE J. Solid State Circuits, 2007)

200°C direct bonding copper interconnects : Electrical results and reliability. - Léa Di Cioccio; Rachid Taibi; Cédrick Chappaz; Stéphane Moreau; Laurent-Luc Chapelon; Thomas Signamarcheix (3DIC, 2011)

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. - Thomas Frank; Stéphane Moreau; Cédrick Chappaz; Patrick Leduc; Lucile Arnaud; Aurélie Thuaire; Emmanuel Chery; F. Lorut; Lorena Anghel; Gilles Poupon (Microelectron. Reliab., 2013)

Stress management strategy to limit die curvature during silicon interposer integration. - Benjamin Vianne; Alexis Farcy; Vincent Fiori; Cédrick Chappaz; Norbert Chevrier; G. Lobascio; Pascal Chausse; F. Ponthenier; A. Ruckly; Stéphanie Escoubas; Olivier Thomas (3DIC, 2015)

Experimental evaluation of friction reduction in ultrasonic devices. - Thomas Sednaoui; Eric Vezzoli; Brygida Maria Dzidek; Betty Lemaire-Semail; Cédrick Chappaz; Michael Adams 003 (World Haptics, 2015)

Psychophysical Power Optimization of Friction Modulation for Tactile Interfaces. - Thomas Sednaoui; Eric Vezzoli; David Gueorguiev; Michel Amberg; Cédrick Chappaz; Betty Lemaire-Semail (EuroHaptics (2), 2016)

Friction Reduction through Ultrasonic Vibration Part 2: Experimental Evaluation of Intermittent Contact and Squeeze Film Levitation. - Thomas Sednaoui; Eric Vezzoli; Brygida Maria Dzidek; Betty Lemaire-Semail; Cédrick Chappaz; Michael Adams 003 (IEEE Trans. Haptics, 2017)