Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer. - Jui-Chin Chen; John H. Lau; Tzu-Chien Hsu; Chien-Chou Chen; Pei-Jer Tzeng; Po-Chih Chang; Chun-Hsien Chien; Yiu-Hsiang Chang; Shang-Chun Chen; Yu-Chen Hsin; Sue-Chen Liao; Cha-Hsin Lin; et al. (3DIC, 2013)

A High Layer Scalability TSV-Based 3D-SRAM With Semi-Master-Slave Structure and Self-Timed Differential-TSV for High-Performance Universal-Memory-Capacity-Platforms. - Meng-Fan Chang; Chih-Sheng Lin; Wei-Cheng Wu; Ming-Pin Chen; Yen-Huei Chen; Zhe-Hui Lin; Shyh-Shyuan Sheu; Tzu-Kun Ku; Cha-Hsin Lin; Hiroyuki Yamauchi (IEEE J. Solid State Circuits, 2013)