Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis. - Ming-Chih Yew; Chan-Yen Chou; Kuo-Ning Chiang (Microelectron. Reliab., 2007)

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact. - Chan-Yen Chou; Tuan-Yu Hung; Shin-Yueh Yang; Ming-Chih Yew; Wen-Kun Yang; Kuo-Ning Chiang (Microelectron. Reliab., 2008)