Mechanism of wire bond shear testing. - Subramani Manoharan; Chandradip Patel; Stevan Hunter; F. Patrick McCluskey (Microelectron. Reliab., 2018)

Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment. - Subramani Manoharan; Chandradip Patel; F. Patrick McCluskey; Michael G. Pecht (Microelectron. Reliab., 2018)