Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. - Tong Hong Wang; Sara N. Paisner; Chang-Chi Lee; Susan Chen; Yi-Shao Lai (Microelectron. Reliab., 2011)

Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. - Yi-Shao Lai; Meng-Kai Shih; Chang-Chi Lee; Tong Hong Wang (Microelectron. Reliab., 2012)

Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. - Tong Hong Wang; Ching-I Tsai; Chang-Chi Lee; Yi-Shao Lai (Microelectron. Reliab., 2013)

A Sub-1 ppm/°C Precision Bandgap Reference With Adjusted-Temperature-Curvature Compensation. - Hou-Ming Chen; Chang-Chi Lee; Shih-Han Jheng; Wei-Chih Chen; Bo-Yi Lee (IEEE Trans. Circuits Syst. I Regul. Pap., 2017)

Pesticide Residue Testing System for Fruits and Vegetables by Color Identification Technology. - Chang-Chi Lee; Yu-Sung Liu; Chun-Hsiang Tseng; Jeng-Yue Chen; Fuh-Shyang Juang; Yung-Ying Chang; Hung-Chih Hsu (ICCE-TW, 2019)

A High-Precision Bandgap Reference With a V-Curve Correction Circuit. - Chang-Chi Lee; Hou-Ming Chen; Chi-Chang Lu; Bo-Yi Lee; Hsien-Chi Huang; He-Sheng Fu; Yong-Xin Lin (IEEE Access, 2020)

Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package. - Cadmus C. A. Yuan; Chang-Chi Lee (IEEE Access, 2020)