The performance improvement of a photo card reader by the use of a high-integration chip solution with double FIFO buffers. - Ying-Wen Bai; Chang-Chih Liu (IEEE Trans. Consumer Electron., 2005)

Performance and process characteristic of glass interposer with through-glass-via(TGV). - Chun-Hsien Chien; Hsun Yu; Ching-Kuan Lee; Yu-Min Lin; Ren-Shin Cheng; Chau-Jie Zhan; Peng-Shu Chen; Chang-Chih Liu; Chao-Kai Hsu; Hsiang-Hung Chang; Huan-Chun Fu; Yuan-Chang Lee; et al. (3DIC, 2013)